Low noiseDC FanWhat are the heat transfer methods?
Low noise DC fan wind pressure and air volume are two relative concepts. Generally speaking, DC cooling fans in the manufacturer's cost-saving considerations, to design the fan's large air volume, it is necessary to sacrifice some wind pressure. If the fan can drive a large amount of air flow, but the wind pressure is small, the wind cannot blow to the bottom of the radiator (this is why some fans have high speed and large air volume, but the heat dissipation effect is not good). On the contrary, large wind pressure often means that the air volume is small, and there is not enough cold air to exchange heat with the heat sink, which will also cause poor heat dissipation effect. The following small series for everyone to share low noise DC fan heat transfer in several ways.
Any type of radiator is basically inseparable from the following three heat transfer methods, but the focus is different.

1. Heat conduction, heat convection and heat radiation. The matter itself or when the matter is in contact with the matter, the transfer of energy is called heat conduction, which is the most common form of heat transfer. For example, the way in which the CPU heat sink base is in direct contact with the CPU to take away heat is heat conduction.
2. Thermal convection: refers to the heat transfer method in which the flowing fluid (gas or liquid) takes the heat away. In the heat dissipation system of the computer case, the "forced thermal convection" heat dissipation method in which the cooling fan drives the gas flow.
Thermal radiation: refers to the transfer of heat by ray radiation, the most common daily is solar radiation. These three heat dissipation methods are not isolated. In daily heat transfer, these three heat dissipation methods occur at the same time and work together.

For example, in a common CPU air-cooled heat dissipation fan, the CPU heat sink is in direct contact with the CPU surface, and the heat on the CPU surface is transferred to the CPU heat sink through heat conduction. The flow of air in the chassis also takes away the heat of the air around the CPU heat sink through thermal convection until outside the chassis. At the same time, all parts with high temperature will radiate heat to parts with low surrounding temperature.
The heat dissipation efficiency of the radiator The thermal conductivity of the radiator material, the heat capacity of the radiator material and the heat dissipation medium, and the effective heat dissipation area of the radiator are related to parameters such.

What is the inherent defect of DC cooling fan?
The most widespread form is to use axial fans (that is, the most common kind of fans) to blow down. The reason why it is so popular is that the overall effect is good and the cost is low. If the direction of the axial fan is reversed, it becomes upward pumping, which is used in some special types of radiators. The difference between the two forms of air supply lies in the different forms of air flow. When blowing, turbulent flow is generated, and the wind pressure is large but vulnerable to resistance loss. When pumping, laminar flow is generated, and the wind pressure is small but the air flow is stable. In theory, the heat dissipation efficiency of turbulent flow is much greater than that of laminar flow, so it has become the mainstream design form. Although the axial flow fan is widely used, it also has inherent defects. The axial flow fan is blocked by the position of the motor, and the airflow cannot smoothly pass through the middle of the blast area, which is called the "dead zone".

Shenzhen Jiangshanlai Electronic Technology Co., Ltd. is a professional brushless DC motor, DC cooling fan, DC brushless fan, DC bracket fan, supercharged cooling fan, micro cooling fan, DC cooling fan, DC blower and non-standard customized fan A large-scale enterprise integrating R & D, manufacturing, sales and service, DC fan manufacturer, DC fan supplier wholesale. Products sell well in Guangdong, Shenzhen, Guangzhou, Dongguan, Fujian, Zhejiang, Jiangsu and other places.